In practice, for equivalent levels of thermal conductance, the VIG is much thinner in profile, considerably lower in weight, greater durability in thermal and mechanical performance over a +25 yr service life, and since it can be paired with all existing technologies to produce hybrid designs, has a potential U-value lower limit at about 0.2 W m-2 K-1. Since the original VIG invention (reported in the early 1990’s) of The University of Sydney, numerous research efforts around the world have led to a fundamental understanding of the critical design and production issues. This has resulted in innovative VIG designs, a range of innovations in the production components, and as many as 14 manufacturing plants over three continents. The purpose of this talk is to review the VIG technology background, and then provide an overview of the current status of the technology. And then finish with the current road map for future advances in unit design, component material innovation and manufacturing potential. Currently, in our developed nations, building energy consumption has grown to a level that is reaching beyond 40% of total final national energy consumption [1]. Much of this energy us...